Founded in 1995 in Buc Versailles Grand Parc, France, 3D PLUS is a leading provider of advanced microelectronic components and solutions. The company specializes in the design and manufacturing of high-performance, miniaturized electronic modules used in high-technology industries such as aerospace, defense, security, and avionics.

3D PLUS offers a wide range of products, including memory and IP cores, computer cores, interfaces, POL converters, peripherals, radiation protection ICs, camera heads, and custom System in Package (SiP) solutions. These products are designed to meet the stringent requirements of space missions and other high-reliability applications.

The company's business model revolves around providing cutting-edge microelectronic solutions that enhance the performance and competitiveness of their clients' systems. 3D PLUS generates revenue through the sale of its specialized electronic components and custom solutions to major players in the global space industry and other high-technology sectors.

3D PLUS has achieved numerous milestones, including the development of the first 2 Gb Space NAND Flash memory for NASA's Pluto New Horizon exploration mission in 2006, and participation in significant space missions such as the Philae Rosetta comet landing, Chinese lunar missions, and the Mars Curiosity and Perseverance rover landings.

Keywords: microelectronics, aerospace, defense, security, avionics, miniaturization, high-performance, space missions, custom solutions, high-reliability.